Description
Double sided copper clad, for making PCB's.
Product Specifications
- Thickness of top copper layer: 0.035mm
- Type of top layer copper: electrodeposited ED
- Substrate: FR4, TG130, UL94VO
- Thickness of substrate: 62thou FR4 (1.575mm)
- Thickness of bottom copper layer: 0.035mm
- Type of bottom layer: copper electrodeposited ED
- Total thickness: 1.645mm (1oz copper + 62thou FR4 + 1oz copper = 0.035+1.575+0.035)
| Length : 20 cm | Width : 15 cm |
| Height : 7.5 cm |
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